Apparatus and method for air-cooling an electronic assembly
US6134108A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1998 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | Jun 18, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved cooling apparatus and related method are disclosed for air-cooling an array of electronic components mounted on a substrate. The cooling apparatus directs high-speed jets of cooling air directly at special heat sinks bonded to the particular electronic components that generate the most heat (e.g., microprocessors), with the air thereafter being directed to flow tangentially across the remaining components, to air-cool those components, as well. This configuration enables the requisite component cooling to be achieved with substantially reduced air flow rates and with heat sinks of substantially reduced size, as compared to prior cooling apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.