Room temperature gold wire wedge bonding process
US6135341A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 27, 1999 |
| Grant date | Oct 24, 2000 |
| Priority date | — |
| Expiry date | May 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20308
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a bond structure wherein there are provided a conductive aluminum bond site (15), a gold wire (13) and a wedge bond tool (11). The gold wire is made to contact the aluminum bond site to provide an interface of the gold wire and the aluminum bond site. A mashing force (9) is applied at the interface with the wedge bond tool and ultrasonic energy (5,7) at an ultrasonic frequency above 165 KHz and preferably 193 KHz is applied at the interface for a period sufficient to cause bonding of the gold wire and the aluminum bond site with the application of ultrasonic energy commencing with the interface at room temperature, generally from about 15.degree. C. to about 25.degree. C. The ultrasonic frequency is generally applied for a period from about 0.5 to about 10 milliseconds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.