Method of labeling housings of electronic assemblies and product produced thereby

US6135505A · kind A · utility

Assignee

• Temic Telefunken Microelectronik · DE

Inventors

• Guenter Fendt · Schrobenhausen, DE
• Richard Baur · Brackenheim, DE

Key dates

• Filing date: Sep 25, 1998
• Grant date: Oct 24, 2000
• Expiry date: Sep 25, 2018

Classification

• Technology area (CPC G): Physics
• CPC primary: G09F7/165
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

In a method of labeling housings of electronic assemblies, and especially electronic assemblies used in motor vehicle systems, at least some of the identifying indicia are applied directly as a deformation on or in the outer surface of a wall of the housing. The identifying indicia can be formed by laser etching of the housing surface, stamping of the housing surface, or forming the identifying indicia directly in the injection or casting mold used for molding the housing. The security and reliability of the labeling is improved because the identifying indicia cannot become detached from the housing as in the case when all of the identifying indicia are provided on a separate label plate or sticker. Additional identifying indicia, such as an optically scannable bar code, are printed on an adhesive label including a peel-off strip, and the adhesive label is affixed onto the outer surface of the housing.