Substrate holding device and polishing method and polishing apparatus using the same
US6135858A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 1, 1998 |
| Grant date | Oct 24, 2000 |
| Priority date | — |
| Expiry date | Jul 1, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate holding device includes a frame member for holding a substrate on an open side of the frame member, the open side being formed by a recess in the frame member, a plurality of fluid chambers disposed concentrically in the recess of the frame member, a respective wall face on the substrate holding side of the frame member at least partially defining each fluid chamber, each wall face being formed by a deformable resilient film, a controller for separately controlling the pressure inside of each of the fluid chambers, and at least one guide ring disposed adjacent to a respective one of the plurality of fluid chambers on the substrate holding side of the frame member, the at least one guide ring being movable relative to the frame member by varying the pressure inside a respective fluid chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.