Electrically conductive adhesive transfers
US6136127A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 5, 1998 |
| Grant date | Oct 24, 2000 |
| Priority date | — |
| Expiry date | Oct 5, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/914
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrically functional adhesive transfer for use in the manufacture and/or the design of flexible membrane circuits. Electrical circuit elements, instead of being printed directly upon polyester film substrates, are printed upon a carrier sheet. A pressure sensitive adhesive is applied over the exposed surfaces of the printed circuit pattern on the carrier sheet and covered by a release paper. The circuit later is applied to any desired substrate by peeling away the release paper and mounting the circuit by means of the pressure sensitive adhesive. The carrier sheet typically is peeled away after the circuit is adhesively bonded to the substrate. The carrier sheet desirably is transparent or translucent in order to facilitate visual alignment of the circuit pattern with the substrate to which it is being bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.