Process for producing a carbon film on a substrate
US6136160A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 8, 1999 |
| Grant date | Oct 24, 2000 |
| Priority date | — |
| Expiry date | Jul 8, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/35
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In order to process a carbon film carbon is deposited on a substrate by sputtering from a carbon sputter target in a gas mixture which contains nitrogen in a minimum proportion of 20% and a sputter gas at a predetermined gas pressure and the substrate is then subjected under a high vacuum to thermal treatment at a temperature above 100.degree. C. The carbon films produced in this manner comprise a fiber and/or tube structure which extends substantially perpendicular to the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.