Energy cured sealant composition
US6136398A · kind A · utility
33Cited by
52References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1998 |
| Grant date | Oct 24, 2000 |
| Priority date | — |
| Expiry date | May 1, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1476
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable composition formed by mixing components comprising 10 to 70 weight percent of a curable epoxy resin; an effective amount of a curative for the epoxy resin; 10 to 85 weight percent of a thermoplastic ethylene-vinyl acetate copolymer; and 5 to 60 weight percent of a thermoplastic polyester resin, the parts by weight being based on the total weight of the resin in the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.