Multiple wavelength laser arrays by flip-chip bonding

US6136623A · kind A · utility

Assignee

• Xerox Corporation · US

Inventors

• Daniel Hofstetter · Sunnyvale, US
• Clarence J. Dunnrowicz · Waltham, US
• Decai Sun · Los Altos, US
• Ross D. Bringans · Cupertino, US
• Michael A. Kneissl · Berlin, DE

Key dates

• Filing date: May 6, 1998
• Grant date: Oct 24, 2000
• Expiry date: May 6, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/4087
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

This invention relates to a multiple wavelength laser structure, and more particularly, to a multiple wavelength laser array structure fabricated by flip-chip bonding from laser structures on two different substrates. A side by side red/IR laser structure is flip-chip bonded to a blue laser structure to form a red/blue/IR hybrid integrated laser structure.