Patent · US Expired

Method and device for positioning and retaining micro-building-blocks

US6137172A · kind A · utility

1Cited by
3References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 20, 1997
Grant dateOct 24, 2000
Priority date
Expiry dateOct 20, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/15165
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

In order to simplify handling and mounting of chips or chip-like structures/micro-blocks, a method and a device have been developed, by which, depending on the area of use, one or more chips can be assembled to act together and/or act together with other chip-like structures such as micromechanical building elements or microoptical elements. The actual retention of a micro-building-block (1) is achieved by micromechanical tongues (4) acting across holes or cavities (2) in a carrier material (3). Silicon tongues can, for example, be both flexible and sufficiently strong to retain a chip. In this manner, there is assured both precise vertical and horizontal positioning and mechanical retention. Electrical connection to the chip can be effected either by thin film technology or by more conventional wire-bonding.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.