Air-cooled electronic apparatus
US6137682A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1999 |
| Grant date | Oct 24, 2000 |
| Priority date | — |
| Expiry date | Jan 11, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An electronic apparatus includes a circuit board, a connector provided on the circuit board, an integrated circuit module attached to the connector, and a heat sink attached to the integrated circuit module. A heat transfer device is disposed at a position separate from the heat sink and arranged in a cooling air passageway. A heat conduction path thermally connects the heat sink with the heat transfer device. Since the heat transfer device can be arranged outside the frame of the apparatus, the heat transfer device can be constructed to have a sufficient cooling capacity, while the integrated circuit module and the heat sink can be constructed in a relatively compact design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.