Method of manufacturing an extruded, tiered high fin density heat sink
US6138352A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1999 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Jan 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49393
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An extruded, tiered high fin density heat sink (10) uses extruded first base, second base and bridging elements (12, 16, 14) having an arrangement of closely spaced, parallel fins (20, 26, 32, 38) and recesses (22, 28, 34, 40) for receiving opposing fins in the elements. The fins (20, 38) in the first and second base elements (12, 16) are bonded to recesses (28, 34) in opposite common faces (24, 30) of bridging elements (14) while fins (26, 32) extending from both opposing faces (24, 30) of bridging element (14) are bonded in aligned recesses (22, 40) in the first and second base element (12, 16) forming an extruded, tiered, high fin density heat sink (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.