Multiple stage wet processing platform and method of use
US6138694A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1999 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Mar 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multiple stage wet processing platform includes a sealable enclosure, at least two processing modules positioned within the enclosure, at least one of them including a housing having an opening and a door moveable into position covering the opening, at least two processing vessels within the housing, and an intra-module robot within the housing and including a wafer support member, the intra-module robot moveable to a first position in which the support is disposed in a first one of the processing vessels and a second position in which the support is disposed in a second one of the processing vessels. An inter-module robot is positioned within the enclosure and is moveable between a first position adjacent to a first one of the modules and a second position adjacent to a second one of the modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.