Interleaved-fin thermal connector
US6138748A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1997 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Nov 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to provide a thermal coupling between a heat source and a heat sink, an interleaved-fin connector is provided. The connector comprises first and second substrates. The first substrate includes a first surface. A plurality of first channels are etched on the first surface to form a plurality of first fins and a first base. The first base can be thermally engaged with the heat source. The second substrate includes a second surface having a plurality of second channels etched therein. The second channels form a plurality of second fins and a second base. The second base can be thermally engaged with the heat sink. The first and second fins providing a thermally conductive path from the heat source to the heat sink when interleaved with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.