Selective removal of vertical portions of a film
US6139647A · kind A · utility
4Cited by
21References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1998 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Apr 2, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A post-etch structure resulting in the inverse of a sidewall spacer etch, i.e. removal of the spacer. A vertical portion of a film is removed while leaving horizontal portions substantially intact. A facet is left in the film in register with an upper corner formed by the vertical and horizontal portions of the underlying body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.