Dip surface-treatment system and method of dip surface-treatment using same
US6139708A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Aug 7, 1998 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Aug 7, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D13/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a system for treating a surface of an article with a liquid material by dipping. This system includes (a) a major tank having therein the liquid material for dipping the article thereinto; and (b) a circulatory mechanism for circulating the liquid material through the major tank. The circulatory mechanism is arranged to make a flow of the liquid material through the major tank such that the majority of the flow is in one direction that is substantially along the longitudinal direction of the major tank. Thus, contaminants and/or bubbles are not distributed over the entire major tank, but are effectively promptly removed from the major tank. The flow of the liquid material may include a first flow of the liquid material in the major tank and a second flow that is lower than the first flow in position. The first and second flows run substantially in parallel with each other, before the first and second flows reach a downstream end thereof in the major tank. The major tank may be formed at the downstream end with a wall having a special configuration such that the first and second flows separate or diverge from each other at the downstream end, and thus the fl…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.