Methods for manufacture of electronic devices
US6139762A · kind A · utility
2Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1998 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Dec 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to new methods for manufacturing electronic packaging devices, particularly printed circuit boards. Methods of the invention include use of reduced pH sweller and etch treatments that can produce printed circuit boards and other devices that are substantially more robust and reliable than produced by prior methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.