Polishing composition and polishing method employing it
US6139763A · kind A · utility
45Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1999 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Dec 1, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition comprising the following components: PA1 (a) an abrasive, PA1 (b) an oxidizing agent capable of oxidizing tantalum, PA1 (c) a reducing agent capable of reducing tantalum oxide, and PA1 (d) water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.