Compact post-mold cooling device and method for thermally conditioning molded articles
US6139789A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 1999 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Apr 20, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/253
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a multi-stage, post-mold cooling method and apparatus used in conjunction with an injection molding machine having an aggressive cycle time and a high output. The apparatus of the present invention includes a thermal conditioning device/station with cooling tubes for keeping separate the preforms of each batch and effecting cooling of the molded preforms, several separated cooling levels for simultaneously cooling multiple batches of preforms, and internal devices for automatically transferring each batch of molded preforms from one cooling level to the next. In a preferred embodiment, the thermal aconditioning device/station is partially sealed to create a controlled temperature environment for conditioning the molded articles. In another embodiment, the thermal conditioning device/station includes a level for re-heating the preforms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.