Patent · US Expired

Method relating to the manufacture of a semiconductor component

US6140194A · kind A · utility

0Cited by

14References

10Claims

0Family size

Assignee

Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

Håkan Sjödin · Knivsta, SE
Anders Soderbarg · Uppsala, SE
Nils Ogren · Sundbyberg, SE
Ivar Hamberg · Stockholm, SE
Dimitri Olofsson · Danderyd, SE
Karin Andersson · Stockholm, SE

Key dates

Filing date	Mar 3, 1998
Grant date	Oct 31, 2000
Priority date	—
Expiry date	Mar 3, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH10D84/038
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A manufacturing method for semiconductor components is disclosed which will allow better precision in the definition of the doped areas of the components and the separation of differently doped areas. A selectively shaped area of, for example, polysilicon, defining the area or areas to be doped, is deposited on the component before masks are applied. This makes the positioning of masks less critical because they only have to be positioned within the area of the polysilicon layer. In this way, an accuracy of 0.1 .mu.m or better can be achieved.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.