Formed sheet of thermalconductive silicone gel and method for producing the same
US6140258A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1999 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Apr 27, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2369
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A formed sheet of thermalconductive silicone gel is provided. The formed sheet has (i) a thin film reinforcement layer hardened into rubber only in a surface layer on the upper side, the lower side, or both sides, (ii) a sheet-shaped reinforcement material buried in a surface layer of the upper or the lower side, or (iii) a sheet-shaped reinforcement material buried in a surface layer of the upper side or the lower side of the sheet, and a thin film reinforcement layer hardened into rubber in this surface layer or in a surface layer on both sides of the sheet. The formed sheet of thermalconductive silicone gel has low compressibility, high strength, is easy to handle during the mounting process, and can be reused after its contact compression between a chip and a heat sink has been released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.