Semiconductor device
US6140697A · kind A · utility
21Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser (114), coil (115) and thin-thickness integrated circuit (312) are extremely thin, the resulting semiconductor device is strong to bending and highly reliable at a low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.