Method for making electrical device
US6141870A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1997 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Aug 4, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24331
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer electrical device such as a printed circuit board, and method for making the electrical device, having a tooth structure for joining at least one of the layers. The method includes the following steps: providing a base; preparing the base and adding a conductive layer to the base; applying a dielectric material to the conductive layer; preparing the applied dielectric material for receipt of the conductive coating; forming openings (vias) through holes in the applied dielectric coating; etching cavities in the applied dielectric material; applying a conductive coating to the cavities in the applied dielectric material; and forming a metal layer on the conductive coating to produce a tooth structure set in the dielectric coating. The tooth structure preferably has obtuse teeth in the range of 1-2 tenths of a mil deep that mechanically join a dielectric material to a subsequently added metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.