Molded selective solder pallet
US6142357A · kind A · utility
21Cited by
15References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 15, 1998 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Oct 15, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.