Diffusion barrier and adhesive for PARMOD.TM. application to rigid printed wiring boards
US6143356A · kind A · utility
42Cited by
4References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 6, 1999 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Aug 6, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
PARMOD.TM. materials comprised of a metal powder or metal powder mixture of specified characteristics and a Reactive Organic Medium, are easily printed or deposited on electronic components, such as a Printed Wiring Board substrate, and cured at low temperatures to form a highly conductive, well bonded, well consolidated pure metal component. The adhesion of PARMOD.TM. conductors on an electronic component is enhanced by printing the PARMOD.TM. on a polyimide coating which has been applied to the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.