Glass substrate having fine holes
US6143382A · kind A · utility
29Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1998 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Jun 2, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24273
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A glass substrate having fine holes formed therein by use of a laser beam without cracks or fragmentation occurring. A glass substrate is used in which silver is contained in the form Ag atoms, Ag colloid or Ag ions, to a predetermined depth from a surface of the glass, and further the concentration gradient of the silver is a maximum at one side surface on which the fine hole machining is performed and gradually decreases toward the other side surface, whereby ablation and evaporation occurs from the surface having the maximum concentration of silver layer by layer without causing cracking or fragmentation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.