Polycarbodiimide resin-containing adhesive and flexible printed circuit board
US6143409A · kind A · utility
6Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1998 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Nov 25, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31605
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Described is an adhesive containing a polycarbodiimide resin having repeating units represented by the following formula: EQU .paren open-st.R--N.dbd.C.dbd.N.paren close-st..sub.n wherein R is a divalent hydrocarbon group and n is an integer of 5 to 250, and also described is a flexible printed circuit board and a coverlay film fabricated using the above-described polycarbodiimide resin-containing adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.