Diazodisulfone compound and radiation-sensitive resin composition
US6143460A · kind A · utility
18Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1999 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | May 19, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/106
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A novel diazodisulfone compound capable of generating acid having high sensitivity to far ultraviolet rays typified by a KrF excimer laser and the like and capable of providing a resist with superior resolution and patterns when used as a photoacid generator for a chemically amplified resist, and a radiation-sensitive resin composition comprising the diazodisulfone compound. The diazodisulfone compound is represented by the following formulas (1) and (2). ##STR1## The radiation-sensitive resin composition comprises the diazodisulfone compound and resin represented by 4-hydroxystyrene/4-(1'-ethoxyethoxy)styrene copolymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.