Method for the apparatus of conductive curable polyester moulding compounds
US6143810A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 1999 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Mar 24, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for preparing a conductive curable moulding compound with reduced electrical surface resistance, comprising mixing together an unsaturated polyester resin, a thermoplastic polymer, a conductive paste and optionally a filler, and is characterized in that the conductive paste is obtained by dispersing conductive pigment particles in a solution of a thermoplastic polymer in a suitable solvent. The invention further relates to the conductive paste itself and to mouldings having reduced surface resistance, obtained therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.