Enclosure for dissipating heat away from a heat sensitive device using bicarbonate compositions
US6143978A · kind A · utility
11Cited by
12References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1998 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Mar 31, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/021
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides methods and compositions useful for heat absorption and dissipation, which include between about 10 percent and about 99 percent by weight of a bicarbonate compound and between about 90 percent and about 1 percent by weight of binder, and thermally protected enclosures including the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.