Selectively bonded pump diaphragm
US6145430A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1998 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Jun 30, 2018 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05C2253/04
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A selectively bonded two-ply diaphragm for a diaphragm pump having adjacent first and second layers of the diaphragm which are selectively bonded at the interface between the layers in at least one attachment portion, which is adapted for attachment to a pump. A working portion is provided in which the first and second layers are free to move relative to one another at the interface. The attachment portion may include a central portion which is adapted for attachment to a diaphragm rod of a pump and a peripheral portion surrounding the central portion which is adapted for stationary attachment to a pump housing. The working portion joins the peripheral portion and the central portion. Selective bonding of the diaphragm is by at least partially bonding or substantially bonding the first and second layers at the interface in the peripheral portion, the central portion, or both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.