Non-connected drainage channels for selective wave solder pallets
US6145729A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 18, 1998 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Jun 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wave solder pallet having a first side that is adapted to receive a printed circuit board and a plurality of through holes or apertures that will allow solder to be transmitted through to selected regions on the printed circuit board. The surface of the base plate that is positioned adjacent the solder wave has channels formed therein, the channels being tapered inwardly so that the overall volume of the channel is greatest at the periphery of the pallet. The increased volume of the channel reduces the pressure effect of the solder wave as it contacts the pallet at the periphery thereby reducing the amount of solder that is splashed over the pallet. The tapering of the channel uniformly increases the pressure so that the pressure effect of the solder wave is increased when it travels through the apertures. Moreover, at a location adjacent the through holes, the surface of the pallet is closer to the solder wave than at some other locations, so as to increase the pressure effect of the solder wave within the adjacent aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.