Flexible laminate for flexible circuit
US6146480A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1999 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Mar 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.