Weld bonding method
US6146488A · kind A · utility
22Cited by
4References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 21, 1997 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Oct 21, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.