MT CVD process
US6146697A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 2, 1999 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Mar 2, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T407/27
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention comprises a method for coating at least one substrate with a carbonitride-containing coating by a MT CVD process which includes heating a substrate or substrates to a reaction temperature in a reaction chamber and then introducing into the reaction chamber a deposition process gas comprising from about 1 to about 30% of a hydrogen halide and predetermined amounts of a carbon/nitrogen source, a metal-halogen compound, H.sub.2, and optionally N.sub.2 so that a layer of the carbonitride-containing coating deposits on the surface of the substrates or substrates. The present invention also includes embodiments for coating at least one substrate with a carbonitride-containing coating by a MT CVD process which includes maintaining a temperature gradient in the reaction chamber during the introduction of the deposition process gas into the reaction chamber. Carbonitride-containing coatings that may be applied by the method include carbonitrides, oxycarbonitrides, and borocarbonitrides of Ti, Hf, Zr, V, Nb, and Ta and their mixtures and alloys.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.