Barrier metallization in ceramic substrate for implantable medical devices
US6146743A · kind A · utility
77Cited by
24References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1999 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Mar 31, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.