Patent · US Expired

Radiation sensitive terpolymer, photoresist compositions thereof and 193 nm bilayer systems

US6146793A · kind A · utility

15Cited by
3References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 22, 1999
Grant dateNov 14, 2000
Priority date
Expiry dateFeb 22, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S430/111
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A terpolymer with chemically amplified (acid labile) moieties and organosilicon moieties suitable for use as the binder resin for a photoimageable resist photoresist composition suitable for use in 193 nm photolithographic processes. The terpolymers have the following structural units: ##STR1## where R is a methyl or hydroxyethyl group, R.sup.1 is a hydrogen atom, a methyl group or a --CH.sub.2 COOCH.sub.3 group and R.sup.2 and R.sup.3 are each independently a hydrogen atom or a methyl group.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.