Process for removing contaminant from a surface and composition useful therefor
US6147002A · kind A · utility
41Cited by
4References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 26, 1999 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | May 26, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing aqueous composition comprising a fluoride containing compound; a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.