Colloidal silica slurry for NiP plated disk polishing
US6149696A · kind A · utility
86Cited by
25References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 6, 1997 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Nov 6, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A novel colloidal silica slurry including additives for enhancing the removal rate of a metallic workpiece, preventing etch pits, and enhancing smoothness. These additives include HNO.sub.3, H.sub.2 O.sub.2 and Al(NO.sub.3).sub.3. In lieu of colloidal silica, colloidal alumina can be used. The metallic workpiece can be NiP, Ni, Al or other appropriate materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.