Low thermal conductivity in-mold label films
US6150013A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1996 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Feb 23, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention is an in-mold label film comprising at least two layers with one layer being a heat seal layer for bonding the film to a polymer substrate wherein the film has a thermal conductivity of less than about 1.250.times.10.sup.-4 k-Cal/sec cm .degree. C. The invention further includes a process for in-mold labeling comprising the steps of forming a label comprising at least two layers with one layer being a heat seal layer for bonding the film to a plastic substrate wherein the film has a thermal conductivity of less than about 1.250.times.10.sup.-4 k-cal/sec cm .degree. C. inserting the label into a mold for producing the plastic substrate with a inside and outside surface thereafter forming a plastic substrate in the mold with sufficient heat wherein the outside surface of the substrate bonds with the heat seal layer of the label.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.