Clover-leaf solder mask opening
US6150061A · kind A · utility
1Cited by
14References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 17, 2000 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Jan 17, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder mask having a clover-leaf shaped opening around a PTH for enhanced performance. The solder mask resides on a surface of a printed circuit board comprising lands and PTH's. The opening around the PTH is configured to maintain a minimum channel width between the PTH and an adjacent land while maximizing the opening around the PTH, thereby decreasing the likelihood that the solder mask material will be inadvertently drawn into the PTH.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.