Encapsulation method of a polymer or organic light emitting device
US6150187A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1998 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Jul 27, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/844
Abstract
The present invention relates to the encapsulation for extending the lifetime of a flexible organic or polymer light emitting device and, more particularly, to encapsulation by sealing with multiple polymer films to prevent the penetration of oxygen and moisture into an organic or polymer light emitting device. Due to the encapsulation of polymer light emitting device with the multiple polymer films, exposure to moisture and oxygen are prevented, which are causes of device degradation. When using a plastic substrate whose the thermal endurance is high, simultaneously, it has a thermal endurance effect to the Joule heat during device operation. Accordingly, there can be fabricated an organic or polymer light emitting display whose lifetime is extended through the encapsulation of an organic of polymer light emitting device with multiple polymer films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.