Method and apparatus for singulating semiconductor devices
US6150240A · kind A · utility
23Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1998 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Jul 27, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/7487
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for singulating semiconductor devices (21) is provided. This approach eliminates the need for an adhesive tape. A fixture (10) is provided to hold the joined semiconductor devices. The fixture has grooves (14 and 18) to accommodate a saw blade (35). The saw makes a cut in two directions thereby separating or singulating the semiconductor devices. Bars (24) are placed across the semiconductor devices when sawing in the second direction to hold the semiconductor devices in the holding fixture. A pick and place machine can then be used to remove the singulated semiconductor devices from the holding fixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.