Patent · US Expired

One-component epoxy resin for covering electronic components

US6150435A · kind A · utility

4Cited by

1References

12Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Heiner Bayer · Olching, DE
Barbara Lehner · Munich, DE
Ernst Wipfelder · Munich, DE

Key dates

Filing date	Nov 12, 1998
Grant date	Nov 21, 2000
Priority date	—
Expiry date	Nov 12, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.