Surface modified nozzle plate
US6151045A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1999 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Jan 22, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14491
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The specification describes a method and composition for treating selected areas of the surface of a polyimide material used to make a nozzle plate for an ink jet printer in order to decrease the surface energy of the polyimide material so ink repellency of the material is increased in the selected areas. The method includes applying a polydialkylsiloxane having reactive end groups to the selected areas of the polyimide material and curing the polydialkylsiloxane on the surface to provide a surface having decreased surface energy. A particularly preferred polydialkylsiloxane is an amine terminated polydialkylsiloxane having a molecular weight ranging from about 500 to about 40,000 number average molecular weight. Because the polydialkylsiloxane is relatively stable at the adhesive curing temperatures used to bond the nozzle plate to a semiconductor chip, the polydialkylsiloxane can be applied prior to curing the adhesive thereby reducing the steps required to provide nozzle plates having decreased ink wettability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.