IC socket having standoffs
US6152756A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1999 |
| Grant date | Nov 28, 2000 |
| Priority date | — |
| Expiry date | Aug 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1053
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A socket for interconnecting a PGA package with a circuit board comprises a base, a cover slidably attached to the base, and supporting means downwardly extending from the base. The base comprises a pair of extension plates diagonally extending therefrom. The supporting means in the form of a pair of standoffs is formed on the respective extension plates. Since each standoff has a height slightly smaller than that of solder balls formed on a lower surface of the base, the standoffs rest on the circuit board after the socket is soldered thereto. By such a design, the external force employed to actuate the cover to slide along the base is transferred from the base to the standoffs. Hence, deformation of the base and damage to the solder joint are obviated to ensure a reliable connection between the PGA package and the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.