Polishing machine
US6152805A · kind A · utility
32Cited by
8References
91Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 16, 1998 |
| Grant date | Nov 28, 2000 |
| Priority date | — |
| Expiry date | Jul 16, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/888
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a polishing machine in which the polishing face of the polishing pad is made to contact the polishing object face of the wafer with efficient supply of the polishing agent on the polishing object face of the processing object in the polishing process, the polishing object face of the wafer being polishing by allowing at least either one of them to rotate, wherein the wafer is polished by repeatedly making a contact and non-contact between the polishing pad and wafer during the polishing process in the polishing agent accommodated in the vessel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.