Metal rinsing process with controlled metal microcorrosion reduction

US6153018A · kind A · utility

Assignee

• INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW · BE

Inventors

• Antonio Luis Pacheco Rotondaro · Dallas, US
• Rita Vos · Tremelo, BE
• Mark Heyns · Linden, BE

Key dates

• Filing date: Dec 9, 1997
• Grant date: Nov 28, 2000
• Expiry date: Dec 9, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/31133
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Process for rinsing a metallized substrate subject to metal microcorrosion using an acidic aqueous rinsing solution wherein the rinsing solution comprises at least one strong inorganic acid in an amount enough to reduce the alkalinity of the rinse solution to a level low enough to reduce microcorrosion of the said metal layer while rinsing.