Curable polymethylsiloxane composition
US6153689A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 1997 |
| Grant date | Nov 28, 2000 |
| Priority date | — |
| Expiry date | Aug 18, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D183/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a curable polymethylsilsesquioxane composition that uses polymethylsilsesquioxane obtained from inexpensive precursors and that provides a hard, scratch-resistant, highly corrosion-resistant, water-repellent, and transparent cured film. The curable polymethylsilsesquioxane composition of the invention includes a polymethylsilsesquioxane having the general formula EQU (CH.sub.3 SiO.sub.3/2).sub.n (CH.sub.3 Si(OH)O.sub.2/2).sub.m and a predetermined number-average molecular weight, Mn, from 380 to 2,000, wherein m and n are positive numbers that provide the predetermined Mn, with the proviso that the value of m/(m+n) is less than or equal to 0.152/(Mn.times.10.sup.-3)+0.10 and greater than or equal to 0.034/(Mn.times.10.sup.-3) and 10 to 250 weight parts colloidal silica.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.