Lead conditioning system
US6155311A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1998 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Dec 29, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for conditioning the leads of a semiconductor device. The system includes a base having anvil surfaces configured to form the leads to a predetermined shape, and forming arms mounted to the base. An actuator is movable relative to the base to move the forming arms from a first position, with the forming arm spaced from the leads, to a second position, with the forming arm urging the leads against the anvil surface to form the leads to a predetermined configuration. Adjustment means adjust the position of said anvil and arms. A video scanner scans sample semiconductor devices and generates lead dimension and configuration signals. A processor processes said signals and applies the processed signals to the adjustment means to form leads of a semiconductor device to predetermined dimensions and configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.