Double polishing head
US6155913A · kind A · utility
9Cited by
7References
40Claims
0Family size
Assignees
Inventor
Key dates
| Filing date | Apr 12, 1999 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Apr 12, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Double or multiple unit polishing heads are used thereby negating the negative effects that irregularities in the surface of the polishing pad have on the polishing results obtained. Adjacent double or multiple unit polishing heads rotate in opposite directions thereby eliminating the effects of microscopic directions in the surface of the polishing pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.